Address1The position is responsible for the CAD packaging of Infotainment systems and its child parts like head unit, speakers, USB docking modules, MIC, Antenna, PDC, camera etc
2. Understand the requirement from Vehicle side in terms of carry over aggregate s and new development of cockpit electronics aggregates if any1) Carry out competition benchmarking, tear down analysis to explor e different mounting strategies, manufacturing processes/ technologies, material etc.2) Conduct a packaging study by placing the ag gregates in line with the CAS requirement.3) Create concept level CAD models at the concept freeze stage for packaging study.4) Pr ovide technical solution in terms of customization of respective aggregates keeping the CAS same.5) Knowledge of Electronics parts ted products will be added advantage.6) Prepare proposals by modifying the CAS keeping the aggregates as carryover.7) Create desig n guidelines/packaging recommendations for mechanical integration for various cockpit electronics aggregates.8) Create TALC (Touch, Appearance, Look & colour) document and ensure maintenance during product lifecycle.9) Review the mechanical design of respective aggregate with supplier before tool kick off; this includes component level DFMEA, Process controls, IQC, OQC check point etc.10) E nsure 3D/2D drawing correctness and release in PLM within stipulated time.
1. Expertise in software like Catia v5.2. Proven exper ience in design and development of plastic, switches, sheet metal etc.3. Good knowledge of material standards, new technologies in manufacturing domains etc.4. Knowledge of DFMEA process5. Knowledge of GD&T6. Hands on experience on Product life cycle managemen t system (PLM).7. Experience on mechanical assembly,packaging.1. Good knowledge of material standards, new technologies in manuf acturing domains etc.2. Knowledge of international process standards like EMS, ISO, TS 16949 will be added advantage.
