Principal Thermal/Mechanical Engineer

#CAASE #AZURE #Cloud #azurehwjobs

Responsibilities

• Lead the thermal design and analysis of cloud hardware components, including servers, racks, power distribution systems, and cooling systems.
• Collaborate closely with cross-functional teams, including electrical engineers, mechanical engineers, and system architects, to develop and implement thermal solutions that meet performance and reliability requirements.
• Conduct thermal simulations, modeling, and analysis to assess system-level thermal performance and optimize cooling strategies.
• Define and establish thermal design guidelines, specifications, and test plans for cloud hardware products.
• Evaluate and select appropriate cooling technologies, such as liquid cooling, air cooling, and heat sinks, to ensure efficient heat dissipation and thermal management.
• Perform root cause analysis and troubleshooting of thermal issues during hardware development and deployment.
• Lead thermal validation and testing activities, including thermal chamber testing, thermal cycling, and thermal characterization.
• Stay up-to-date with industry trends and emerging technologies related to thermal management in cloud hardware development.
• Provide technical guidance and mentorship to junior thermal engineers, fostering their professional growth and development.
• Collaborate with vendors and suppliers to assess thermal performance of off-the-shelf components and develop customized solutions as necessary.
• Lead Mechanical Design: Take ownership of mechanical design projects from concept to completion, leading a team of engineers to develop innovative solutions for cloud-based hardware infrastructure.
• System Architecture: Collaborate with cross-functional teams, including electrical engineers and software developers, to define system architecture and develop mechanical specifications based on functional requirements.
• Design and Prototyping: Design mechanical components, systems, and assemblies using CAD software and create prototypes for testing and validation.
• Performance Optimization: Conduct analysis, simulations, and tests to optimize mechanical system performance, reliability, and thermal management, ensuring efficient operation and meeting industry standards.
• Design Review and Documentation: Conduct design reviews, generate engineering documentation, including design specifications, test plans, and reports, and ensure compliance with regulatory and safety standards.
• Collaboration and Leadership: Collaborate with multidisciplinary teams to ensure seamless integration of mechanical systems, provide technical guidance and mentorship to junior engineers, and foster a culture of innovation and continuous improvement.
• Vendor Management: Collaborate with external vendors and suppliers to source components, review manufacturing processes, and ensure adherence to quality standards.
• Emerging Technologies: Stay abreast of the latest trends, advancements, and best practices in mechanical engineering, cloud infrastructure, and data center technologies, and propose innovative ideas to enhance our hardware offerings

Qualifications

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a related field. Master's or Ph.D. in Thermal Engineering or a relevant discipline is preferred.
• Extensive experience (8+ years) in thermal design and analysis for complex hardware systems, with a focus on cloud infrastructure.
• Strong knowledge of heat transfer principles, fluid dynamics, thermodynamics, and computational fluid dynamics (CFD) simulations.
• Experience with liquid cold plate designs
• Solid understanding of cloud hardware components, architectures, and cooling technologies.
• Demonstrated experience in designing and implementing thermal solutions for high-power and high-density systems.
• Familiarity with industry standards and regulations related to thermal management in data center environments.
• Excellent problem-solving and analytical skills, with the ability to identify and resolve complex thermal issues.
• Strong communication and interpersonal skills, with the ability to effectively collaborate with cross-functional teams and communicate technical concepts to both technical and non-technical stakeholders.
• Leadership experience, including the ability to lead and mentor a team of thermal engineers.
• Adaptability: Ability to thrive in a fast-paced, dynamic environment, adapt to changing priorities, and manage multiple projects simultaneously.
• Industry Knowledge: Familiarity with cloud infrastructure, data center operations, and related technologies, such as server racks, power distribution, cooling systems, and cable management
• 10+ years of hands-on experience in the electronics design industry with a track record of production designs.
• Proficient at PTC Creo and PDMLink software.
• Experience in sheet metal design, PCA mechanical design, plastic design.
• Experience in cross-discipline design process working with other HW members develop optimized solutions from chip to the rack level
• Experience in managing ODMs
• Experience with prototyping and high volume

• Education: Bachelor's or Master's degree in Mechanical Engineering or a related field. A Ph.D. is a plus.
• Experience: Minimum of 8-10 years of experience in mechanical engineering, preferably with a focus on hardware development, data center infrastructure, or cloud computing.
• Technical Skills: Proficiency in CAD software (e.g., PTC Creo), experience with simulation tools (e.g., ANSYS, COMSOL), and a strong understanding of mechanical design principles, material selection, and manufacturing processes.
• Leadership Abilities: Demonstrated experience in leading and managing a team of engineers, coordinating complex projects, and driving innovation in a collaborative environment.
• Problem-Solving: Strong analytical and problem-solving skills, with the ability to identify and resolve mechanical design issues and optimize system performance.