AddressJob Posting Date & Status : 26th DEC 2020 & ACTIVE
IC Package: Failure Analysis & Reliability Engineer(Engineering)
Job Opening at : A Sahasra Group Company
Job Location : Bhiwadi
Salary : As per industry trends
Job Category : Full-time
Min. Qualification : B.Tech./BS in materials science with +> 8 years of industry experience
we are looking for an enthusiastic Failure Analysis & Reliability Engineer with more than 3 years of experience in IC package Failure Analysis and reliability. It requires very good knowledge of IC packaging process flow such as die attach, wire bonding, molding and EOL.
Role & Responsibilities : A Failure Analysis & Reliability Engineer, your responsibilities include the following:
IC package Failure analysis flow (customer, internal), debugging, report generation, 8D report.
Reliability flow, test requirement as per JEDEC standard.
Complete knowledge of FA tools (Prober, Microscope, CSAM, SEM, X-Ray, X-section, de-capping, etc).
Complete knowledge of reliability tests with conditions (HAST, TC, MSLs, BLR, ST, T shock, etc).
Debugging using prober to verify failures.
Basic level knowledge of Performing Electrical Failure Analysis to verify failures.
Working with several cross-functional teams for resolving product level issues.
Performing Data Analysis and possessing parsing skills to analyse high volume data for quality improvement and yield improvement.
Analysing and evaluating component specifications versus performance to ensure optimal match of component requirements with production equipment capabilities.
Working with manufacturing and test teams to ensure on-time product qualification.
Working with cross-functional teams to resolve external customer related issues.
Knowledge of wire bond, die attach, DBG, Molding, Saw singulation, laser mark, laser cut, etc.
Materials property and chemistry.
Basic knowledge of quality flow.
Preferred Qualifications:
Electrical Failure Analysis, identifying root cause of the problems and developing counter measures.
Quality, reliability mechanisms and device physics.
Wafer and component level testing and yield improvement.
Note : Interested & Genuine Candidate can email their CV on Mehnaz@sahasraelectronics.com
